november 2011 doc id 018926 rev 1 1/7 7 STPS3150-Y automotive power schottky rectifier features aec-q101 qualified negligible switching losses low forward voltage drop for higher efficiency and extented battery life low thermal resistance ecopack ? 2 compliant component description packaged in smb, this device is intended for use in automotive applications where low drop forward voltage is required to reduce power dissipation. table 1. device summary symbol value i f(av) 3 a v rrm 150 v t j (max) 175 c v f (max) 0.67 v k a smb stps3150uy www.st.com
characteristics STPS3150-Y 2/7 doc id 018926 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.59 x i f(av) + 0.023 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 150 v i f(av) average forward current t l = 130 c = 0.5 3 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 80 a t stg storage temperature range -65 to +175 c t j operating junction temperature range (1) -40 to +175 c 1. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj --------------- 1 rth j a ? () ------------------------- - < table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead 20 c/w table 4. static electrical characteristics symbol parameter tests co nditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 0.4 2.0 a t j = 125 c 0.6 2.0 ma v f (2) forward voltage drop t j = 25 c i f = 3 a 0.78 0.82 v t j = 125 c 0.63 0.67 t j = 25 c i f = 6 a 0.85 0.89 t j = 125 c 0.70 0.75 1. t p = 5 ms, < 2% 2. t p = 380 s, < 2% figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p (w) f(av) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i (a) f(av) t =tp/t tp = 1 = 0.5 = 0.05 = 0.1 = 0.2 i (a) f(av) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 175 t =tp/t tp t (c) amb r =75c/w th(j-a) r=r th(j-a) th(j-i)
STPS3150-Y characteristics doc id 018926 rev 1 3/7 figure 3. non repetitive surge peak forward current versus overload duration (maximum values) figure 4. normalized avalanche power derating versus pulse duration i (a) m 0 1 2 3 4 5 6 7 8 9 10 11 12 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 t(s) t =25c a t =75c a t =125c a smb 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm figure 5. normalized avalanche power derating versus junction temperature figure 6. relative variation of thermal impedance junction to ambient versus pulse duration 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-a) th(j-a) t =tp/t tp t (s) p smb single pulse figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) i (a) r 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 0 25 50 75 100 125 150 v (v) r t =125c j t =150c j t =100c j t =50c j t =25c j t =75c j c(pf) 10 100 1000 1 10 100 1000 f=1mhz v =30mv t =25c osc rms j v (v) r
characteristics STPS3150-Y 4/7 doc id 018926 rev 1 figure 11. thermal resistance junction to ambient versus copper surface under each lead figure 9. forward voltage drop versus forward current figure 10. forward voltage drop versus forward current i (a) fm 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 v (v) fm t =25c (maximum values) j t =125c (typical values) j t =125c (maximum values) j i (a) fm 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 v (v) fm t =25c (maximum values) j t =125c (typical values) j t =125c (maximum values) j r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s (cm2) cu epoxy printed circuit board fr4, copper thickness = 35 m
STPS3150-Y package information doc id 018926 rev 1 5/7 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. smb footprint (dimensions in mm) table 5. smb dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 d 3.30 3.95 0.130 0.156 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62
ordering information STPS3150-Y 6/7 doc id 018926 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode stps3150uy g315y smb 0.107 g 2500 tape and reel table 7. document revision history date revision description of changes 03-nov-2011 1 initial release.
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